Epoxy resin board serves as the base material for printed circuit boards. A copper-clad epoxy resin board has a layer of copper foil laminated on one or both sides. This epoxy resin board provides mechanical support for electronic components.

The glass transition temperature of epoxy resin board is 130-140°C for FR4 grade. Epoxy resin board with a Tg of 170°C is used for lead-free soldering. The thermal expansion of epoxy resin board matches copper to prevent trace cracking.

Epoxy resin board for RF applications has a controlled dielectric constant (4.2-4.8). High‑purity epoxy resin board minimizes ionic contamination for reliable circuits. Epoxy resin board is available in thicknesses from 0.2 mm to 3.2 mm.

Drilling of epoxy resin board requires carbide bits with 100,000 rpm spindles. Epoxy resin board with UV blocking prevents solder mask curing issues. The water absorption of epoxy resin board affects impedance control.

Epoxy resin board is compatible with HASL, ENIG, and OSP finishes. A halide‑free epoxy resin board meets environmental regulations. Epoxy resin board with a matte finish reduces glare during assembly inspection.

Epoxy resin board can be routed to create custom shapes for sensors. The storage life of epoxy resin board is 6 months in controlled humidity. Epoxy resin board remains the standard material for prototyping and low‑volume electronics.